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HOME> Foundry Service
> CVD |
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Wafer
diameter |
100mm, 150mm |
Thickness |
500 ~ 2.5um |
Uniformity |
~ 3% |
Process |
SiO2, SiNx, Poly-Si |
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Wafer
diameter |
100mm,
150mm |
Thickness |
~ 1um |
Uniformity |
< 5% |
Process |
SiO2, SiNx, a-Si |
Thick
film deposition more than 10um
Low hydrogen content because of high plasma density
(ICP Source)
Film Stress controllable |
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Wafer
diameter |
100mm,
150mm |
Thickness |
~ 1um |
Uniformity |
< 5% |
Remark |
For Actuator application |
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